Armstrong In The Media

Armstrong Fluid Systems Shanghai receives SBR's Tech Award for Connectivity

Posted by Armstrong Fluid Technology on Aug 24, 2020 8:11:52 AM

As Seen on sbr.com.sg - June 09, 2020

Armstrong’s Design Envelope technology is an innovation that enables cost savings and energy savings in HVAC systems.

Armstrong Fluid Technology has been selected to receive the TEA award for the Connectivity - Building Services and Facilities category. For several decades, Armstrong Fluid Technology has provided cost-effective solutions that elevate the fluid-flow manufacturing industry to a new level across the globe. Armstrong maintains seven manufacturing facilities located on four continents, and the company currently employs more than a thousand people worldwide.

For properties that rely on HVAC systems, achieving reliable, first-rate and affordable indoor comfort is vital. Singapore Business Review (SBR) recognizes the insightful role of organizations that design and develop these products and strategies in the technology sphere. That is why the SBR Technology Excellence Awards (TEA) for 2020 has unveiled new winners whose primary work is defined by distinction, innovation, effectiveness, influence and vigor.

Design Envelope Technology is a revolutionary solution that enables the most ecological, versatile and cost-effective HVAC systems. Working closely with designers, installers, operators and maintenance personnel to support their use of design envelope technology Armstrong Fluid Systems Shanghai Ltd serves customers by helping them maximize energy efficiency and reduce lifecycle costs.

Armstrong Fluid Technology is dedicated to sustainability and has worked as a pioneer, helping companies and industries transition to responsible and sustainable energy use.

Design Envelope technology uses advanced digital controls combined with advanced hydraulics to provide up to 80 percent energy savings compared to traditional throttled pump operations.

To measure the Design Envelope technology’s performance, Armstrong has hired Bureau Veritas (BV), an external auditor and third party organization, to inspect process assessment and validate pump performance data for Wei Lai Building in Zhengzhou, China.

Constructed in 1997, the Wei Lai Building property includes offices and a hotel and operates 24/7. The original 10 End-Suction constant speed pumps were installed over 18 years ago and were scheduled for an upgrade.

The building owner chose to install 10 Vertical In-Line Armstrong DE pumps along with a chiller plant control system. The retrofit initiative was centered on energy savings, performance coefficient, and overall plant optimization. To validate the energy performance, the company hired Bureau Veritas (BV) to be the project’s external auditor. BV was tasked to monitor the entire process assessment and to verify the pump performance data.

The building owner’s initial expectation was a pay-back period of three years, and the project was expected to only achieve 40 percent energy savings.

BV staff gathered and evaluated data and discovered that by reducing old 90 kilowatt pumps to Armstrong 55 kilowatt pumps, there was a significant savings increase that reached up to 74.9 percent kilowatts per hour annually. This validates energy savings from the organization’s Design Envelope compared to conventional constant-speed pumps. The retrofit installation was completed without a concrete base and spring isolators. The installation cost savings combined with energy savings will provide a payback period of 1.4 years.

The proprietor was impressed with the Armstrong Design Envelope Technology, especially since it is able to achieve a return on investment of less than two years with up to 74.9 percent energy savings in this particular upgrade initiative.

Watch the interview below to know more about their winning project:

 

 

The Technology Excellence Awards, presented by Singapore Business Review, was held via video conferencing throughout the first and third week of June.

This year’s nominations were judged by a panel consisting of Daryl Pereira, Head of Cyber at KPMG; Cheang Wai Keat, Head of Advisory Services in Singapore and ASEAN Technology Consulting Leader at Ernst & Young; Chin Chee Choon, Advisory Leader and Assurance Director at Nexia TS; Rizwi Wun, Partner, Acting Head of Intellectual Property and Technology Practice Group at RHTLaw Asia; Carolyn Chin-Parry, Managing Director and Digital Accelerator Leader at PwC.

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Topics: Awards, Design Envelope, In The Media

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